AI Occupancy Sensor (Area Pro)

AI Occupancy Sensor (Area Pro)

The follow-up sensor needed to triple coverage and run AI at the edge while staying invisible in a ceiling. Outerspace packed that compute into a housing 40 percent smaller than the previous generation.

Summary

Industry
  • Safety & Industrial
Expertise
  • Electronic engineering
  • Firmware Design
  • Industrial Design
  • Mechanical Engineering
Awards
Good Design Award

Project Details

Project Details

Challenge

High-Compute, Small-Footprint

The Area Pro represents a massive technological leap over its predecessor. To deliver real-time data at the “edge,” the device required a quad-core processor and a dedicated Neural Processing Unit (NPU).

Thermal Architecture & Mechanical Logic

To manage the heat of the NPU, we replaced active cooling with a custom-stylised passive die-cast heat spreader. This component acts as both the structural spine of the device and its thermal engine. Through rigorous thermal partitioning, we isolated sensitive electronics from heat-generating components. These early calculations were validated with physical test rigs—using resistors to simulate real-world thermal loads—ensuring long-term reliability before a single production tool was cut.

Outcome

Area Pro covers up to 3,000 square feet per sensor at close to 99 percent real-time accuracy, letting enterprise deployments run on roughly half the sensors and 80 percent less cabling than before. All processing happens on-device, with no images or personal data ever captured.

Technical Insights:

Electronic engineering (Capability)

Edge AI processing architecture fitted inside a housing 40 percent smaller than the prior generation

Mechanical engineering (Capability)

Thermal and power management for high-compute hardware in a discreet ceiling-mount form

Industrial design (Creativity)

Compact form factor designed to be functionally invisible in any office fit-out.

Project image
To manage the heat of the NPU, we replaced active cooling with a custom-stylised passive die-cast heat spreader. This component acts as both the structural spine of the device and its thermal engine.
Unit underside
XY sense PCB board in black
The AI occupancy sensor held by hands
The AI occupancy close up
The AI occupancy sensor installed in roof of office area
Image

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