AI occupancy sensor

In the modern, hybrid, post-COVID world, where a large percentage of office employees split their time between working in the office and working at home, understanding how spaces are used is more critical than ever. But traditional sensors often fall short, offering either “creepy” surveillance or inaccurate data.

When XY Sense needed to evolve their market-leading occupancy sensor, they turned to Outerspace to bridge the gap between high-compute AI and a discreet, manufacturable reality.

The brand new Area Pro sensor is the next-generation occupancy sensor for smarter, AI-driven offices. Designed to provide a better understanding of office spaces utilisation by employees.

Client

Industry

Safety and Industrial

Expertise

Electronic Engineering
Firmware Design
Industrial Design
Mechanical Engineering
XY Sense Ai utilisation monitoring deivce designed and engineered by Outerspace for XY Sense
XY Sense Ai utilisation monitoring deivce designed and engineered by Outerspace for XY Sense

The Challenge: High-Compute, Small-Footprint

The Area Pro represents a massive technological leap over its predecessor. To deliver real-time data at the “edge,” the device required a quad-core processor and a dedicated Neural Processing Unit (NPU).

The Core Challenge?

Packing that much processing power into a small, fanless housing without compromising the electronics or the aesthetic. Our team provided technical assistance across every facet of the hardware design to solve the “thermal burden” of modern AI.

Thermal Architecture & Mechanical Logic

To manage the heat of the NPU, we replaced active cooling with a custom-stylised passive die-cast heat spreader. This component acts as both the structural spine of the device and its thermal engine. Through rigorous thermal partitioning, we isolated sensitive electronics from heat-generating components. These early calculations were validated with physical test rigs—using resistors to simulate real-world thermal loads—ensuring long-term reliability before a single production tool was cut.
XY Sense Ai utilisation monitoring deivce designed and engineered by Outerspace for XY Sense
XY Sense Ai utilisation monitoring deivce designed and engineered by Outerspace for XY Sense

Electronic & Software

Using Altium Designer, we engineered a high-density, multi-layered rigid PCB. We transitioned from the multi-board architecture of Gen 1 to a single-board design, significantly simplifying assembly. Our embedded software team supported the bring-up with customisation, driver integration, and device tree updates, ensuring the hardware and software were functioning perfectly prior to the machine learning algorithms and client IoT rollout.

Design for Manufacture (DFM) & Sustainability

How we met ambitious targets by optimising the footprint:
  • Waste Reduction: By “clipping the corners” of the circular PCB, we maximized usable area and minimized eWaste during fabrication.
  • 2K Injection Moulding: This achieved a premium, “hidden-until-lit” indicator effect, allowing the sensor to remain unobtrusive during use while providing clear feedback when needed.
  • Senselink™ Daisy-Chaining: We engineered the physical interface for XY Sense’s proprietary daisy-chaining, allowing one gateway to power 30 sensors  – slashing installation costs and material waste.
The Area Pro is more than a sensor; it’s a masterclass in functional minimalism. By combining housing and heatsink functions and refining the assembly process, Outerspace helped XY Sense launch a product that is smaller and faster—all while maintaining the “restrained but distinctive” look that high-end corporate environments demand.
XY Sense Ai utilisation monitoring deivce designed and engineered by Outerspace for XY Sense
XY Sense Ai utilisation monitoring deivce designed and engineered by Outerspace for XY Sense
XY Sense Ai utilisation monitoring deivce designed and engineered by Outerspace for XY Sense

Technical Insights:

Electronics Hardware
Altium Designer, Quad core, NPU, PoE, BGA, Multiple layer rigid PCB, Custom HDR Camera lens and FPC, Ethernet, USB
Mechanical Engineering
Solidworks, CNC Prototypes, Die-Cast, Injection moulding 2K (2 part), custom LED light pipe, water drain, and ingress protection
Verification and Validation
Passes EMC and Safety testing. Thermal calculations and real-world thermal testing, IP seal design and testing, benchmark testing
Manufacturing
Multiple demonstration prototypes, multiple alpha prototypes, and new product introduction to the manufacturer. Design for test rig automation. Automated IoT provisioning and optical calibration
Embedded Software
Device tree updates, Driver integration. Hardware bring up and embedded software integration.
Industrial Design
Styling and surface modelling, Rendering, colours, materials, and finishing
Project and program management
Coordination of multiple internal and external stakeholders; managing technical and program risks to successful delivery
“Our interaction with Outerspace has been truly exceptional. They not only comprehended our requirements but also skilfully transformed our vision into reality. The OSD team played a crucial role in designing and constructing the 1MILLIKELVIN Stress Imaging Camera from the ground up. Their unparalleled expertise and competency truly set them apart! Collaborating with you has been a pleasure, and we eagerly anticipate many more years of successful partnership ahead. – The 1MILLIKELVIN Team”

The 1MILLIKELVIN Team

“A broad range of industry experience from the Outerspace team challenged our assumptions and led to a much better design solution.”

Jim Gallagher

“Our long association with Outerspace has delivered substantial benefits to our development process. This has resulted in medical products that now receive international attention and are achieving record sales.”

Warwick Freeman – Compumedics

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